menzerna polishing compounds GmbH & Co. KG
Phone: +49 (0)7222 91 57 0
Fax: +49 (0)7222 91 57 810
MEASURING EQUIPMENT is essential.
Cutting-edge measuring equipment is the only way to get data
The polishing systems at the Menzerna technical center are equipped with sensors that measure all key operating data, including downforce, application quantity, temperature, rotational speed, cut, shine, and cycle time. The data collected is then analyzed and interpreted using tools and methods developed by us. Thanks to innovative methods, state-of-the-art equipment, and high-performance large-batch production, Menzerna is the preferred development and production partner for perfect polishing processes.
Measuring shine and roughness
Surfaces can be accurately measured using scattered-light technology, with changes in the polishing method immediately visible. Quantitative measurements and visual representations of the surface enable objective evaluation of the polishing result.
Precision weighing technology to determine cut
The cut of a compound or a method can only be ascertained by precisely weighing the workpiece. To this end, we use precision scales that can identify differences in weight of thousandths of a gram, even with heavier workpieces.
Infrared cameras to measure workpiece temperature
In some polishing applications, the workpiece must not be heated above a certain level. We will monitor the workpiece temperature in real time during the polishing process and we will adjust the system’s settings to reflect the temperature tolerance of the material.
Congested nozzles on compound application systems impede the production process. The tendency of emulsions to cause blockages can be quickly and easily determined using fluid mechanics testing.
Emulsions require a certain level of viscosity. This is measured and adjusted at various points during manufacturing. But as viscosity can also be altered by the measurement process itself, highly sensitive viscometers are needed.